HEATSINK COMPOUND NANO DMND 3G SYRINGE

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HEATSINK COMPOUND SYRINGE 3G

Features Nano Diamond for high thermal conductivity. It is electrically insulated so that you can apply to all electronic components and chips and protects from short circuits.

Features:
â‬¢À À À  Instant conductivity
â‬¢À À À  Complete insulation
â‬¢À À À  Thermal conductivity: >3.8W/m-K
â‬¢À À À  Specific resistance: >2.4
â‬¢À À À  Operating temperature: -50À°C-240À°C
â‬¢À À À  Weight: 3g